Multi Skin and Vitamin Care Patch
Multi-Vitamin Patch with Collagen and Omega-3 Fatty Acids
Topical and transdermal drug delivery systems are gaining growing attention in the field of pharmaceutical technology. Avoiding the oral route and delivering active compounds through the skin enhances their therapeutic effect and pharmacological properties [1].
In addition to enhanced delivery system of transdermal route, you will be reducing the digestive strain in comparison to oral route.
Collagen is a major component of your skin.
It plays a role in strengthening skin, as well as in elasticity and hydration. As you age, your body produces less collagen, leading to dry skin and the formation of wrinkles.
Collagen helps maintain the integrity of your cartilage, the rubber-like tissue that protects your joints.
Your bones are made mostly of collagen, which gives them structure and strength.
As the most abundant protein in the body, collagen is an important component of skeletal muscle
Collagen provides structure to your arteries, the blood vessels that carry blood from your heart to the rest of your body. Without enough collagen, arteries may become less flexible and elastic.
Hair and nails. Taking collagen may increase the strength of your nails by preventing brittleness. Additionally, it may help your hair and nails grow longer.
Instructions:
-Remove backing from patch and immediately press onto skin and hold for 10 seconds.
-Apply new patch on skin that is dry, clean and hairless.
-Leave up to 8 hours and dispose.
-1 patch maximum per day.
Topical use only. Do not use on damaged, broke, or irritated skin. Consult your physician if you are pregnant, nursing, taking any medications, or having a known medical condition. Keep out of reach of children. These statements have not been evaluated by the Food and Drug Administration and is not intended to diagnose, treat, cure or prevent any disease.
1. Santos L.F., Correia I.J., Silva A.S., Mano J.F. Biomaterials for drug delivery patches. Eur. J. Pharm. Sci. 2018;118:49–66. doi: 10.1016/j.ejps.2018.03.020.
